It shows very good activation characteristics on the wetting surfaces and leads to very good solder wetting.
Excellent spreading properties on all common solder surfaces.
As far as possible, this flux prevents through its special formulation the corresponding development mechanism or an affinity at the interfaces, respectively.
The malfunction risk potential of the surface mounted assembly by moving blobs is extremly minimised. Cost intensive reworks are reduced.
ISO-Flux® "ELR 3420" is highly temperature stable and therefore very suitable for the lead-free soldering technology