R&G Epoxy Resin L and Hardener L 

The resin system Epoxy Resin L + Hardener L yields superior impregnating and wetting properties towards carbon, glass, aramid and natural fibres.

• Low viscosity
• Highly transparent
• High degree of UV stability
• Tack-free curing even of thin layers
• Glass transition temperature (Tg) max. 76 °C (post-curing at 60 °C / 15 h)
• High static and dynamic strength
• Free of nonylphenol and DETA

Processing time: 40 minutes (100 g / 20 °C)

Mixing ratio:100 : 40 parts by weight resin : hardener 100 : 45 parts by volume resin : hardener

It exhibits a very good price/performance ratio and is suitable for the following processing procedures: 

• Hand laminating
• Vacuum moulding
• Press moulding

Expertise for the resin system Epoxy Resin L + Hardener L: this system is not cytotoxic (cell damaging), important for applications in medical purposes.

Mechanical properties (Neat resin after curing)

Flexural test 

Flexural strength (DIN EN ISO 178): 111 MPa

Flexural modulus (DIN EN ISO 178): 2.960 MPa

Tensile test 

Tensile strength (DIN EN ISO 527): 69 MPa

Elongation at break: 4.7 %

Compression test

Compressive strength (DIN EN ISO 1426): 91 MPa

General information about the system "Epoxy Resin L" with Hardeners S, L, CL, EPH 500, EPH 161, W 300, GL 1 and GL 2

• Low viscosity, free of solvents and fillers
• Fast impregnation of glass, aramid, carbon and natural fibres
• High static and dynamic strength (GL approval with the Hardeners GL 1 and GL 2 being present

Epoxy Resin L with the corresponding Hardeners S, L, CL, EPH 500, EPH 161, W 300, GL 1 and GL 2 is the most commonly used laminating and adhesive resin in R&G`s delivery programme.

In conjunction with the Hardeners S (15 minutes), L (40 minutes), CL (60 minutes), EPH 500 (60 minutes), EPH 161 (90 minutes), W 300 (300 minutes), GL 1 (30 minutes) and GL 2(210 minutes), this epoxy resin exhibits similar mechanical properties to those of the laminating systems usual aerospace .Its heat deflection temperature reaches from 60 °C (S, L, EPH 500, W 300), to 80 °C (GL 1 and GL 2, after post-curing), to 95 °C (CL, after post-curing) and finally to 120 °C (EPH 161, after post-curing).

Its low surface tension, good adhesion, and minimal curing shrinkage makes the Epoxy Resin L ideal for bonding wood, metal, foamed polystyrene like Styropor® etc. It can be processed in all of the customary methods, e.g. hand lay-up, pressure and vacuum impregnation, press moulding and filament winding.